A high-solvency, multi-component solvent blend specifically formulated for reducing the viscosity of two-component epoxy-polyamide systems. It ensures excellent flow, leveling, and substrate wetting without affecting the chemical curing mechanism. Designed to prevent "orange peel" and ensure proper film formation.
Thinning Ratio: Typical addition is 5% to 15% by volume. Actual amount depends on application equipment, temperature, and required DFT. Always mix Part A and Part B thoroughly before adding thinner.
Cleaning: May be used for cleaning spray equipment, brushes, and rollers immediately after use. Not recommended for removing cured epoxy.